bond (Total 10763 Patents Found)

Bond (10763 Patents Found)
A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secu...
An integrated circuit package bond pad includes an insulating layer and an electrode located over the insulating layer. The electrode has a first surface configured to be bonded to external circuitry and a second surface opposite the first surface. A plurality of conductive members is located in the insulating layer, w...
A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater....
A method for making an optical semiconductor device may include forming an integrated circuit (IC) including an optical sensing area and a bond pads outside the optical sensing area, and coupling proximal ends of respective bond wires to corresponding bond pads. The method may further include performing a blackening tr...
An article having as a component a section of nonwoven web formed predominately of polymeric fibers is disclosed. The section of nonwoven web may have a pattern of consolidating bonds impressed on the surface. The bonds may have at least one bond shape; and the bond shape may have a perimeter with a greatest measurable...
An integrated circuit structure includes a semiconductor substrate, and an active device formed at a front surface of the semiconductor substrate. A bond pad is over the front surface of the semiconductor substrate. The bond pad has a first dimension in a first direction parallel to the front surface of the semiconduct...
The bond between an armor and a cable covering jacket is controlled by introducing intervening material at the interface of the layers along selected bond regions. The intervening material can comprise particulate matter or a strip of material introduced at selected locations of the armor perimeter to allow ease of acc...
A semiconductor multi-package module having stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a ...
An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the fir...
The invention relates to the field of chemistry and concerns a method suitable for example for use in the automotive industry or in aircraft construction. The object of the present invention is to provide a method by which a bonding of the regions of the plastics that are in direct contact is accomplished. The object i...
Provided are DTPA derivatives having five carbonyl groups, represented by the following formula (1). Further provided is a process for synthesizing a compound (1a) represented by the formula of a compound (1) in which R 2 is 2-alkenyl group (R 4 ). The process comprises the steps of performing esterification of DTPA, ...
The subject matter disclosed herein relates to gas separation membranes and, more specifically, to polyimide gas separation membranes. In an embodiment, a gas separation membrane includes a porous substrate, a substantially continuous polyimide membrane layer, and one or more layers of boehmite nanoparticles disposed b...
A variety of semiconductor package arrangements and packaging methods are described that improve the reliability of bonding wires that down bond a die to a die attach pad. In one aspect, selected portions of the top surface of a lead frame (which may be in panel form) are plated (e.g., silver plated) to facilitate wire...
A semiconductor device is provided and includes a semiconductor die, and a plurality of bond pads having exposed surfaces arranged in an alternating interleaved pattern on the semiconductor die. Each of the surfaces of the bond pads have a first bond placement area that overlaps with a second bond placement area, with ...
Methods for removing contaminants from a semiconductor device that includes a plurality of aluminum-comprising bond pads on a semiconductor surface of a substrate. A plurality of aluminum-including bond pads are formed on the semiconductor surface of the substrate. A patterned passivation layer is then formed on the se...
A wire bond pad and method of fabricating the wire bond pad. The method including: providing a substrate; forming an electrically conductive layer on a top surface of the substrate; patterning the conductive layer into a plurality of wire bond pads spaced apart; and forming a protective dielectric layer on the top surf...
A bond pad region is provided that reduces parasitic capacitance generated between bond pad metallization and underlying silicon by reducing the effective area of the bond pad, while maintaining flexibility of wire bond sites and ensuring mechanical integrity of the wire bonds. Embodiments provide, in a region that wou...
A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The ...
Methods of forming an aluminum-free wire bond pad and the pad so formed are disclosed. In one embodiment, the method includes forming an opening through a dielectric layer to a last metal of a chip; forming a tantalum nitride (TaN) layer over the chip and over the opening; removing the tantalum nitride (TaN) layer outs...
L'invention se rapporte à un revêtement d'isolation thermique destiné aux aubes et pales de turbomoteurs en superalliage qui sont exposées à des gaz à haute température. Ce revêtement comporte une couche d'aluminure ou de MCrAlY, une couche d'alumine et une couche supérieure en céramique. Cett...
A test device for applying a tensile force to electrical bond sites of a semiconductor device includes jaws ( 21 ), adapted to closely engage the surface of the bond site, typically a solder ball ( 22 ), while an inner edge portion ( 23 ) of each jaw approaches the jaw axis. By closely confining the bond site, the clam...
The present invention efficiently isolates a fault in an inner lead bond region of a μBGA (micro-Ball Grid Array) package for holding an integrated circuit die, while preserving the structural integrity of areas of the μBGA package outside of the inner lead bond region. The method of the present invention includes a ...
Disclosed herein are expression systems that make use of Ero1 to enhance disulfide bond formation and thereby to increase the yield of properly folded recombinant proteins. Also disclosed herein are recombinant Ero1 polypeptides, nucleic acids, vectors, and cells for expressing such polypeptides....
In an example, a method may include dispensing a portion of epoxy on a first surface. The method may also include curing the portion of epoxy to form precured epoxy. The method may also include positioning the first surface and a second surface separated from each other by a gap. The precured epoxy is located within th...
A porous iron system metal bond diamond grinder using diamond as grinding particles and iron system metal powder as binder so as to have a large number of pores in the binder. The grinding particles are chemically and physically combined with the iron system metal to be held. The occupancy rate of pores in the whole gr...
The invention concerns methods and means for preventing the reduction of disulfide bonds during the recombinant production of disulfide-containing polypeptides. In particular, the invention concerns the prevention of disulfide bond reduction during harvesting of disulfide-containing polypeptides, including antibodies, ...
Techniques for bond pad fabrication are provided. In one aspect, a method of forming a bond pad comprises the following steps. At least one alloying element is selectively introduced to at least a portion of at least one surface of the bond pad. The at least one alloying element is diffused into at least a portion of t...
Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate and the other deposited on the second substrate. ...
Adhesive compositions having enhanced bond strength are obtained by mixing a monomeric ester of 2-cyanoacrylic acid with an anionic polymerization inhibitor and from 1 to 30 mmoles per kg. of adhesive of an adhesion promoter of the formula: ##STR1## wherein R' is hydrogen or an alkyl, aryl or cycloalkyl group havin...
A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bon...
本发明涉及含1-烯键的防雾滴剂及其制备方法。结构中含有反应性基团1-烯键、亲水性基团和疏水性基团,在引发剂或者高能射线引发下,可以发生自由基引发的均聚或相互间发生的共聚合反应,该类可聚合性含1-烯键的防雾滴表面活性剂...