packaged (Total 10787 Patents Found)

Most beers brewed with the addition of cysteine proteases, such as papain, ficin or bromelain, for the purpose of chillproofing develop a tendency to gush or foam excessively after being stored in bottles and cans for 1 to 3 months. This gushing tendency is obviated by adding during the beer manufacturing process a spe...
Cells for implantation into a patient are packaged within a barrier of immunoprotective tissue prior to implantation to obviate or minimize rejection of the cells. The preferred immunoprotective tissue for forming the barrier is cartilage. The tissue is formed into a layer that is thin enough to allow diffusion of nutr...
A method for additively de-marking a packaged integrated circuit die bearing engraved marking indicia on an exterior surface thereof. The marked surface is covered with an overlayer of material to fill the engraved markings and provide a surface suitable for re-marking. The covering material may be applied in a flowabl...
A high radiation efficiency antenna system in a package is achieved by the provision of a Dielectric Resonator Package. A Dielectric resonator package comprises a dielectric body of the package forming a dielectric resonator that resonates at radio frequency and a feed substrate having an upper and a lower surface, a f...
Apparatus and methods of accessing a packaged medicament include placing a blister-type package containing the medicament onto a receiving area of a holder with a blister portion of the package extending into an opening in the holder. The blister-type package is held in place while a severing device is moved relative t...
The present invention relates to a method for packaging a compressible product in a compressed state, comprising the step of sealing at least two parts of a polymeric machine direction oriented (MDO) film which encloses at least part of the compressible product in the compressed state, characterised in that the seal ha...
The invention relates to a ball-limiting metallurgy stack for an electrical device that contains at least one copper layer disposed upon a Ti adhesion metal layer. The ball-limiting metallurgy stack resists Sn migration toward the upper metallization of the device....
A first semiconductor substrate having at least one integrated semiconductor device is provided. A lift-off layer is formed on a main surface of the first semiconductor substrate. The lift-off layer is patterned so as to form openings in the lift-off layer that are arranged on either side of a first portion of the lift...
A packaged dental article includes a dental appliance that is precoated with an adhesive. The adhesive is in contact with a flexible film having a low adhesion surface. The film is secured to a container at a location spaced from the appliance so that the film tends to peel away from the adhesive when the appliance is ...
Metal layers of extreme thinness, of the order of fifty Angstroms and greater are detected by use of microwave energy so propagated as to permit determination of the presence or absence of the metal in a detection zone of limited extent outwardly of the issuance location of such propagated energy. Apparatus is provided...
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadfra...
A structure that is constituted by disposing a laminate film and a collector rubber with a metal terminal plate interposed therebetween and a structure that is constituted by disposing a laminate film and a collector rubber with a metal terminal plate interposed therebetween are disposed so as to sandwich a fundamental...
A lead frame for a semiconductor IC device has a pair of common elongated leads and first and second groups of slender leads arranged on opposite sides of the common elongated leads and generally extending transverse to the common elongated leads. The common elongated leads have as their integral parts slender leads ex...
Systems and methods for testing packaged microelectronic devices are disclosed herein. One such system for testing a packaged microelectronic device includes a test socket configured to receive the device for testing and a tester interface including a plurality of test contacts aligned with external contacts of the dev...
An interference interlock between leadframe features and a mold compound is provided in a packaged semiconductor device by exposing at least one predetermined surface area to an etching process prior to a molding step. This produces an etched recess with a recessed wall delimited by a step wall, generally perpendicular...
A wafer-level packaged semiconductor device is described. In an implementation, the device includes one or more self-assembled resilient leads disposed on an integrated circuit chip. Each of the resilient leads are configured to move from a first position wherein the resilient lead is held adjacent to the chip and a se...
Embodiments of a packaged semiconductor device with interior polygon pads are disclosed. One embodiment includes a semiconductor chip and a package structure defining a rectangular boundary and having a bottom surface that includes interior polygonal pads exposed at the bottom surface of the package structure and locat...
In some embodiments, a package substrate for a semiconductor device includes a substrate core and a material layer disposed over the substrate core. The package substrate includes a spot-faced aperture disposed in the substrate core and the material layer....
An embodiment of the present invention includes a plunger, a heating element, and first and second arms. The plunger affixes a first unit to a second unit with adhesive. The first and second units are on a strip of a flexible tape. The strip is on a folding base unit. The folding base unit folds the first unit on top o...
A device is disclosed which includes a flexible material including at least one conductive wiring trace, a first die including at least an integrated circuit, the first die being positioned above a portion of the flexible material, and an encapsulant material that covers the first die and at least a portion of the flex...
In accordance with the invention, a MEMs mirror device comprises a mirror layer including a frame structure and at least one mirror movably coupled to the frame and an actuator layer including at least one conductive path and at least one electrode for moving the mirror. The mirror layer and the actuator layer are prov...
An improved packaged semiconductor device is provided having an electronic component, such as an integrated circuit, enclosed within a single layer ceramic PGA package. A cap, of substantially the same areal dimension as the base, is sealed to the base forming a cavity in which the integrated circuit is mounted. Input/...
Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, a microelectronic imaging device includes a microelectronic die having an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads ele...
A packaged light emitting device includes a carrier substrate having a top surface and a bottom surface, first and second conductive vias extending from the top surface of the substrate to the bottom surface of the substrate, and a bond pad on the top surface of the substrate in electrical contact with the first conduc...
The present invention discloses a method and apparatus for bridging the gap between an integrated circuit package or component mounted on a circuit board and a heat sink such that there is little stress placed on the component, but there is still a connection between the component and the heat sink for dissipation of h...
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a molding compound disposed around the integrated circuit die, and an interconnect structure disposed over the integrated circuit die and ...
本发明公开了一种封装膜以及使用该膜封装的聚合物锂电池。本发明封装膜由外保护层、外粘结层、硅塑料膜、内粘结层、CPP层等构成。使用本发明封装膜的聚合物锂电池由正极片、负极片、隔膜、电解液和本发明封装膜等构成。本发明的新...
【課題】酸性乳ゲル状食品を製造する際に、風味を損なうような塩味が付加されず、加熱殺菌しても粉っぽい食感にならないようにする。 【解決手段】容器に、酸及びレンネット凝固剤を含む第1液を充填した後、該容器に、乳類を含む...
(57)【要約】 【課題】濃厚流動食の投与に関して、取扱いが簡便で衛 生管理に優れ、かつ加水して濃厚流動食の濃度の調整お よび濃厚流動食の投与後の水分補給が容易で、さらにバ ックのまま湯煎等によって加温したり、又は高温にて殺...
本发明涉及具有自组装式弹性引线的晶片级封装装置。描述一种晶片级封装半导体装置。在一实施方案中,所述装置包含安置于集成电路芯片上的一个或一个以上自组装式弹性引线。所述弹性引线中的每一者经配置以从第一位置和第二位置移...
本发明公开了一种整装式催化剂及其制备方法和应用。所述的整装式催化剂是一种多孔化的锚附氧化物的金属相载体上负载活性贵金属或负载活性贵金属及助剂金属氧化物的催化剂。该催化剂的制备是首先用酸或碱对金属相骨架或经合金化处...
本发明提供了一种用于将数字个性体现添加至数字资产的方法。将数字个性体现添加至数字资产使得数字资产的发布者能够将打包的数字权利信息包含在他们的产品中。将消费者的个人信息插入到包括他们的版权义务的其余部分的原稿信息中...
The method involves sealingly isolating a powdered product i.e. milk powder (12) packaged in a bag (10) from the external environment until closure of the bag. The isolation is performed by introducing an inert gas injecting cane (20) and gas mixture extracting canes (22) in the milk powder, injecting an inert gas thro...